A rapid turnaround of prototypes at minimal cost is often a limiting step in the tight schedule for launching new electronic products.  In the validation phase of new chip designs, a rapid evaluation of the performance of chips is often required to check the functionality of the device as a packaged component.  However, for the small numbers of devices to be evaluated, the costs, effort and lead times to tool up for production of a new package are often prohibitive.
GE Aviation-Tewkesbury has a flexible packaging capability for device prototyping together with access to its specialist manufacturing and test equipment. An extensive set of tooled package designs based on ceramic packages, suitable for evaluation of lead free soldering, is available for customers to carry out rapid device prototyping.  The devices are assembled using established die attach, wire bonding and package sealing processes. GE Aviation-Tewkesbury also offers rapid turnaround routes to prototype plastic packaged parts.