There is growing interest in the use of electronic power and control systems installed in high temperature environments, typically endured in; down hole petroleum/gas and geothermal exploration and production; gas/diesel turbine engines for aircraft propulsion and power generation.

This requirement has raised a challenge to the traditional limit of 125^oC for high temperature exposure of electronics systems. The jump in operating temperature to 200^oC (and beyond) means that different semiconductor, circuit board and assembly processes are needed to fulfil the performance specifications.

GE Aviation, as a premier supplier of custom electronic solutions, is constantly striving to extend the operating temperature limits of power and control electronics. This work includes evaluation of; semiconductor foundries with the latest high temperature and radiation hard silicon-on-insulator (SOI) technology; use of ceramic and insulated metal substrates instead of printed circuit boards; sources of passive components with proven performance for many thousands of hours of operation at 200^oC.

GE Aviation is investigating selected packaging materials and assembly techniques to enable reliable manufacture of ASICs and custom electronic modules, which are capable of operating for long periods at up to 200^oC.

Please contact us to take advantage of this comprehensive capability for the design and manufacture of custom electronics, within high temperature and harsh environment applications.