GE Aviation has a capability for flip chip assembly, where development, prototype and low volume production work has been undertaken since 1999. The recent installation of automatic pick and place equipment with flip chip capability has opened up a route for the transfer of procedures to serial production.

Flip chip bonding on a range of substrates (including silicon, glass, ceramic, flexible circuits and printed circuit boards) has been carried out and underfill procedures have been established to provide reinforcement in cases where thermal mismatch is an issue. In addition, chip on chip assemblies have been produced to produce multi-level components where the footprint of the component is minimised (see illustration). GE Aviation has established links with sub-contractors for the supply of bumped wafers.