GE Aviation has built up an extensive Class10,000 clean room manufacturing capability for custom electronic modules, covering thick film substrate manufacture, laser trimming, die attach, automatic gold (Au) and aluminium (Al) wire bonding, flip chip and TAB expertise and a wide range of package sealing and encapsulation options. Our understanding of materials and assembly processes are key factors in producing components that are "fit for purpose" and can meet the stringent demands of high reliability electronics. This manufacturing capability is backed up with a range of electrical and environmental test equipment.