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Application Specific Integrated Circuits (ASICs)

GE Aviation has developed two routes for ASIC manufacture, where prototype and low volume products (mainly packaged in ceramic packages) are produced in a dedicated in-house Class 10,000 Clean room area, using advanced die attach and aluminium wire bonding techniques. For higher volumes, links have been set up with several assembly houses, where products are manufactured following procedures specified by GE Aviation for the production of high reliability electronics.


ASIC mounted in ceramic package

 
 


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Application Specific Integrated Circuits (ASICs)

GE Aviation has developed two routes for ASIC manufacture, where prototype and low volume products (mainly packaged in ceramic packages) are produced in a dedicated in-house Class 10,000 Clean room area, using advanced die attach and aluminium wire bonding techniques. For higher volumes, links have been set up with several assembly houses, where products are manufactured following procedures specified by GE Aviation for the production of high reliability electronics.


ASIC mounted in ceramic package


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