Hybrid circuits on ceramic substrates were first produced at GE Aviation Newmarket in 1976. Since that time, many thousands of custom electronic modules have been produced demonstrating compact, lightweight, high reliability and high performance electronics for the most extreme environments.

A custom electronic module manufactured at GE Aviation Newmarket will provide proven reliability to enable mixed silicon technologies (digital/analogue/mixed signal/power), mixed products (standard and ASIC) and mixed assembly options (surface mount and bare chip) to be delivered in one package, with optimised thermal performance and "fit for purpose" protection against the environment.

GE Aviation offers an extensive range of technologies including thick film on ceramic, co-fired ceramic (HTCC/LTCC), chip on flexi-rigid printed circuit board and direct bonded copper (DBC) on alumina and insulated metal substrates for power applications.

In summary, GE Aviation offers:

• Proven experience of custom electronic module design and manufacture

• Concept to production customer service

• Electrical, thermal and mechanical design and simulation

• No restrictions on volume for prototypes and production

• Wide range of packaging and screening options