For high reliability and high performance applications, where high density electronics are required to meet stringent space and weight specifications, a gold based multi-layer thick film on ceramic technology can provide a cost effective solution.

GE Aviation has developed over many years a standard production capability of 200 micron conductor track and spacing for up to 7 layers on one substrate. High performance dielectrics and vias are screen printed with a standard diameter of 300 micron and via pitch of 500 micron.

The technology is complemented through the deposition of resistors from 1 ohm to 5M ohm with a standard size of 0.4mm x 0.4 mm that can be laser trimmed with tolerances of <0.5%. The maximum available substrate area for print is 114 mm x 114 mm. Other thick film conductors such as Ag-Pd and Ag-Pt are also available.

Through technology partnerships, other substrate types such as LTCC
(Low temperature Co-fired Ceramic), insulated metal substrates, aluminium nitride and steel are supported.