GE Aviation has many years of experience in the design and manufacture of multi-chip modules (MCMs), which offer:

• State of the art miniaturisation

• "System" in a package

• Increased complexity within one module

• Unlimited flexibility for combining ICs and active/passive components in one module

• Reduced weight

• Greater reliability

The capabilities developed by GE Aviation include:

MCM-D: Silicon or glass substrates with deposited inorganic dielectric
MCM-C: Ceramic substrates with thick or thin film conductors/dielectrics
MCM-L: Silicon, glass or printed circuit board (flexible or rigid) with organic laminated dielectric
MCM-V: Silicon on silicon technology to create vertically integrated module with minimum space requirement