Low Temperature Co-Fired Ceramic (LTCC) modules offering leading edge performance in applications such as high frequency communications and harsh environment automotive electronics. The benefits of the technology for these applications include stable electrical performance over the lifetime of the product, capability for hermetic packaging, mechanical robustness and higher frequency capabilities beyond printed circuit boards. There is also a growing interest in the use of LTCC substrates for System-in-Package (SiP) applications in microfluidic, low and high frequency electronics, optical, chemical and biological sensing applications.

GE Aviation-Newmarket has extended its substrate portfolio by establishing a link with a leading European manufacturer of LTCC substrates, Selmic OY, (www.selmic.com) in Finland. The combination of GE Aviation’s expertise in designing and manufacturing high performance custom electronics and specialist electronic packaging knowledge with LTCC substrate technology has created a resource for companies interested in exploiting conventional LTCC and System-in-Package applications.