There is a growing realisation that organic based substrates provide potential cost advantage in areas that have been the traditional reserve of ceramic substrates. Flexi-rigid printed circuit boards can meet the track/gap dimensions and via sizes of ceramic based hybrid technology, but with the added benefit of optimised space utilisation, although they have limitations for high frequency and high temperature applications and in the harshest environments.

GE Aviation can deliver chip on board solutions using bare die with wire bonded and flip chip interconnections, all protected by modern encapsulants and underfills