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Einzigartige Vielfalt von Lösungen für kundenspezifische elektronische Komponenten Gamma senza rivali di soluzioni su ordinazione di componenti elettronici Una gama sin igual de soluciones personalizadas gracias al uso de componentes electrónicos Gamme incomparable de solutions de composants électroniques personnalisés Unrivalled range of custom electronic component solutions
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Obsolete component replacement

It is estimated that 60% of integrated circuits currently in use will become obsolete within 5 years, and yet product lifetimes are often expected to exceed 25 years.

GE Aviation's record regarding obsolescence is unparalleled because we have very carefully chosen the foundries from across the world with which we work. As an example, GE Aviation is still able to source 5 micron gate arrays which were designed twenty years ago.

Our customers typically require us to replace an obsolete EPLD, FPGA or other manufacturer's ASIC, whilst retaining the same footprint and pin-out. Sometimes, we are asked to increase or modify the functionality, and are frequently asked to guarantee component longevity for a decade or longer. We have accomplished these requirements using a variety of techniques, including digital ASICs, mixed signal ASICs, die banking and customised FPGAs (where an FPGA die is custom-packaged to suit the application).

We can retrieve a customer's original design data from most obsolete media or data formats.


diversity of chips which can be replicated

 
 


Email Colleague | | Print Friendly

Obsolete component replacement

It is estimated that 60% of integrated circuits currently in use will become obsolete within 5 years, and yet product lifetimes are often expected to exceed 25 years.

GE Aviation's record regarding obsolescence is unparalleled because we have very carefully chosen the foundries from across the world with which we work. As an example, GE Aviation is still able to source 5 micron gate arrays which were designed twenty years ago.

Our customers typically require us to replace an obsolete EPLD, FPGA or other manufacturer's ASIC, whilst retaining the same footprint and pin-out. Sometimes, we are asked to increase or modify the functionality, and are frequently asked to guarantee component longevity for a decade or longer. We have accomplished these requirements using a variety of techniques, including digital ASICs, mixed signal ASICs, die banking and customised FPGAs (where an FPGA die is custom-packaged to suit the application).

We can retrieve a customer's original design data from most obsolete media or data formats.


diversity of chips which can be replicated


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