The rapid growth in communications systems for wireless and satellite applications has placed severe demands on the products to increase the number of channels available, the functionality and the band width. This has meant that higher speed and higher frequency operation are constantly being sought up to 100GHz frequency and 40Gbit/s speed at an effective cost often with size restrictions.

GE Aviation has invested in the development of technologies that enable operation of electronic sub-systems at high frequencies and speeds including high performance power converters, flip-chip interconnection, LTCC (Low temperature Co-fired Ceramic) substrates and Multi-Chip Modules (MCMs) for system in package applications.