There is a growing demand within the electronics industry for higher frequency and higher speed devices. Flip chip technology offers a number of advantages over traditional wire bonding techniques including:

• Board area reductions of up to 20X

• Height reduction of up to 80%

• Reduction in inductance and capacitance delays by a factor of 10

• Increased number of I/O through use of whole chip area rather than the periphery

GE Aviation has carried out flip chip bonding on a range of devices (Si and III-V semiconductors) and substrates (including silicon, glass, ceramic, flexible circuits and printed circuit boards) has been carried out. In addition, chip on chip assemblies have been produced to produce multi-level components where the footprint of the component is minimised.