GE Aviation Tewkesbury has developed a complex digital multi chip module, which is capable of performing up to 400 Giga-integer operations per second for an arithmetical calculator.

The module consists of 4 silicon chips of 10mm x 20mm assembled within a ceramic package, where the whole unit contains 28M transistors and 1024 processors within a module of approximately 25mm x 50mm dimensions.

The module has the following features:

Silicon Chip

0.35 µm CMOS process
Operation at 3.3V
1.5M gates per chip

Package

Custom tooled multi-layer HTCC (High Temperature Co-fired Ceramic)
Surface Mount Dual in Line with 180 leads

Interconnection

Aluminium wire wedge/wedge bonding at 60µm pitch
Over 450 internal bonds for power and ground connections alone

Multi Chip Module for Giga-Speed Processing