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27 July 2007

New Electronic Packaging Services
GE Aviation-Tewkesbury has recently expanded its rapid prototyping and flexible packaging capability through investment in versatile automated pick and place and wire bonding equipment

14 May 2007

High Temperature Electronics Packaging Research
GE Aviation is managing a new DTI Technology Programmme to develop high temperature packaging solutions for down-well and aero-engine applications.

14 May 2007

Reliability of Chip-on-Board Technology
GE Aviation Newmarket has undertaken extensive reliability tests on chip on board technology for harsh environment applications.

23 February 2007

Reading Displays in High Ambient Lighting
This meeting was organised to raise awareness of the lighting environment on the readability of displays and how to measure the effect.