GE Aviation Newmarket has undertaken an extensive programme of reliability tests to validate the performance of Chip-on-Board (COB) technology for harsh environment applications.

One of the main concerns about the implementation of Chip-on-Board (COB) technology is the reliability of “glob-topped” components in harsh environments. GE Aviation Newmarket has developed new criteria for the evaluation of Chip-on-Board assemblies based on the BS9450 scheme for the certification of electronic components.

A comprehensive test programme has been undertaken on test circuits fabricated on high temperature FR4 and flexi-rigid printed circuit boards and ceramic substrates using both Pb-free and Pb-based solders and selected “glob-top” encapsulants. The tests performed included high temperature storage, operation under rapid change of temperature and “damp heat” testing for representative industrial, telecoms and aerospace/defence environmental performance specifications.

The materials and assembly processes tested have passed all of the environmental tests for durations of at least 1000 hours.

This data provides the assurance that Chip-on-Board technology can be applied in demanding applications, with specific advantages in space restricted systems.

For further information on the high reliability Chip-on-Board technology available at GE Aviation Newmarket, please contact Steve Riches (e-mail: steve.riches@ge.com)