GE Aviation-Tewkesbury has recently expanded its rapid prototype and flexible packaging capability through the investment in versatile automated pick and place and semi-automatic wire bonding equipment.

GE Aviation-Tewkesbury is building on its established track record in assisting companies move from prototype to production by extending its flexible packaging capability for device prototyping together with access to its specialist manufacturing and test equipment.

Investment has been made in an Amadyne Automatic die and component pick and place equipment and a Delvotec semi-automatic wire bonding equipment for ball/wedge, wedge/wedge and deep access bonding.

The company also provides wafer sawing, solder, adhesive and glass package sealing; electrical component test for packaged parts and wafers; and dies of all sizes, including testing up to MIL 883 Class B screening levels.

If access to specific electronic test capabilities is required, GE Aviation-Tewkesbury also has an extensive range of test equipment that can be made available to customers, including:

• Digital testing up to 128 I/O at 100MHz
• Mixed signal testing up to 224 I/O at 100MHz
• Automatic wafer probing
• Life test and burn-in capabilities
• Temperature forcing units and environmental test equipment

To take advantage of any of these capabilities, please contact Ian Chandler on 44 (0) 1 684 297 777 or e-mail ian.chandler@ge.com